Under limited supervision, solder electronic components both surface mount and through-hole devices to printed circuit boards on a wide variety of sub assemblies.
Essential Functions:
· Remove and replace complex thru hole and SMT parts
· Follow and complete ECO instructions
· Remove and replace BGA devices
· Inspect subassemblies containing prior work components
Qualifications/Requirements
· 2+ years experience soldering to IPC standards
· Trained in the following (certifications preferred):
IPC-A-610
J-STD-001
IPC-7711/7712
· Proven ability to read drawings and BOM’s and follow the instructions
· Demonstrated abilities with both RoHS (Lead free) and standard solder